EVG 805 SOI
Classification:
Front-end Equipment (production)
Product Name:
Automated production bonding systems
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- Description
- Parameters
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SOI wafers are a promising new basic material for the microelectronics industry to produce faster and higher-performance microelectronic devices. Wafer bonding, as one key enabling technology for the SOI wafer fabrication process, achieves high-quality single-crystal silicon films on insulating substrates. With the EVG850 SOI production bonding system, all essential steps for SOI bonding – from cleaning and alignment to pre-bonding and IR-inspection – are combined. Thus, the EVG850 assures a high-yield production process for void-free SOI wafers up to 300 mm sizes. Being the only production system built to operate in high-throughput, high-yield environments, the EVG850 has been established as the industry standard in the SOI wafer market.
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● Hallmark
(1) Production systems built to operate in high-throughput, high-production environments
(2) Automated cassette-to-cassette or FOUP-to-FOUP operation
(3) Contamination-free backside processing
(4) Ultrasonic and/or brush cleaning
(5) Pre-bonding by mechanical flush or notch alignment
(6) Advanced remote diagnostics
● Technical Parameters
(1) Chip diameter (substrate size)
100-200, 150-300 mm
Fully automatic money box to money box operation
(2) Pre-bonding chamber
Alignment type: Flat to flat or notch to notch
Alignment accuracy: X and Y: ±50 µm, θ: ±0.1°
Bonding force: up to 5 N Bond wave start position: flexible from wafer edge to center
Vacuum system: 9x10-2 mbar (standard) and 9x10-3 mbar (optional turbo pump)
(3) Cleaning station
Cleaning method: Flushing (standard), megasonic nozzle, megasonic area sensor, nozzle, brush (optional)
Combustion chamber: made of PP or PFA (optional)
Cleaning media: DI water (standard), NH4OH and H2O2 up to 2% (optional)
Spinner chuck: Vacuum chuck (standard) and edge treatment chuck (optional), made of metal-free ionic cleaning material
Rotation: up to 3000 rpm (within 5 seconds)
Cleaning arms: up to 5 media lines (2 lines for 1 MHz systems)
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