EVG 805
Classification:
Front-end Equipment (production)
Product Name:
Stripping Systems
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- Description
- Parameters
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● Specificities
(1)Open adhesive platform
(2)Debond Options: ● Thermal slide off debonding ● Lift off debonding ● Mechanical debonding
(3)Recipe controlled system
(4)Real time monitoring and recording of all relevant process parameters
(5)Unique features for thin-wafer handling
(6)Various chuck designs to support wafer/substrates and carriers up to 300 mm
(7)High topography wafer handling
● Technical data
(1) Wafer Diameter (Substrate Size)
Up to 300mm wafers
Up to 12-inch film frame
(2) Configuration
1 decoupling module
(3) Options
UV-assisted debonding
High-format wafer processing
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Address: Room 102, Building 23, No. 88, Haidian Road, Hecheng Street, Gaoming District, Foshan City, Guangdong Province, China
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Service Hotline：+86-18029396685
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Service Hotline：+86-0757-88866818
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